2025 TPCA Taiwan High-Tech Forum–Japan: Advanced Packaging × High-End Substrates
Original Articles by SemiVision Research (TPCA , TSMC , SPIL , CSUN , Unimicron , NAN YA , EMC ,Eternal)
As AI and high-performance computing (HPC) continue to flourish, advanced packaging and materials technologies have become pivotal drivers in the evolution of the semiconductor industry. In previous supply chain analyses, SemiVision has conducted in-depth discussions on areas such as CoWoS, HBM, and silicon photonics, continuously emphasizing the strategic importance of material innovation. Globally, Japan holds a leading position in the semiconductor materials landscape, not only mastering advanced chemical and substrate technologies but also offering a diversified range of equipment spanning thin-film deposition, etching, metrology, packaging, and photoresist materials—covering the full manufacturing process.
Among these, photoresist materials play a critical role in lithography processes and are now entering a new era of innovation in response to EUV (Extreme Ultraviolet) technology advancements. These include Chemically Amplified Resists (CARs), Non-Chemically Amplified Resists (n-CARs), Inorganic EUV Photoresists, Hybrid EUV Resists, and Metal Oxide Resists (MOR). Each type represents a different path toward achieving high resolution, low line edge roughness, and high sensitivity for next-generation logic nodes.
Meanwhile, in the domain of packaging, “Advanced Substrate” technology has become the next major battleground. Whether it’s enabling high-speed I/O for AI chips, providing wide-bandwidth interfaces for HBM, or supporting mechanical and thermal requirements for heterogeneous integration, the structure and materials of substrates directly determine system performance and yield.
The upcoming Taiwan High-Tech Forum @Japan, organized by TPCA, focuses precisely on these two critical themes: Advanced Substrate for Next-Generation Packaging and High-End Carrier Boards. The event, to be held on June 10 at One Station Hotel in Kumamoto, gathers key experts from Taiwan’s core supply chain—TSMC, SPIL, Unimicron, Nan Ya, EMC, and Eternal—for a day of deep technical exchange. The forum is divided into two main sessions:
Session I explores technical integration within the advanced semiconductor ecosystem
Session II highlights the strategic advantages of Taiwan’s substrate industry
Together, these sessions showcase Taiwan’s capabilities in materials, packaging, and substrate integration, while also addressing Japan’s growing demand for reliable, high-performance platforms.
About TPCA
The Taiwan Printed Circuit Association (TPCA), founded on March 18, 1998, is the central driving force behind Taiwan’s printed circuit board (PCB) industry. As a non-profit organization, TPCA is committed to integrating industry resources, fostering technological innovation, enhancing international collaboration, and elevating the overall competitiveness of the sector. To date, TPCA has over 680 member companies, covering the full spectrum of PCB manufacturing, equipment, materials, and packaging.
Founding Background and Mission
TPCA’s establishment symbolizes unity within Taiwan’s PCB industry and reflects a shift from isolated efforts to collective strength in the global market. Through TPCA, the industry aims to fully integrate and leverage its resources, enhancing overall competitiveness and leading Taiwan’s PCB industry into a new era of excellence.
Core Functions and Services
TPCA’s key missions include:
Industry Integration and Policy Advocacy: Facilitating communication between member companies, government, and academia to promote favorable policies and regulations.
Technology Promotion and Standards Setting: Driving progress in smart PCB manufacturing, eco-friendly processes, and material innovation, while collaborating internationally to establish industry standards.
Talent Development and Training: Supporting professional growth through PCB academies, industry-academia cooperation, and funding for graduate research.
International Exchange and Market Expansion: Hosting events like TPCA Show and the IMPACT International Conference to foster global technical exchange and business collaboration.
Recent Developments and Future Outlook
Amidst dynamic global supply chain shifts and economic uncertainties, TPCA continues to act as a key bridge for the industry—connecting government, enterprises, and international networks. Its current focus lies in three strategic areas: strengthening supply chain resilience, expanding international markets, and enhancing technology R&D and cybersecurity infrastructure.
PCB Expo Taiwan
PCB Manufacturing: manufacture of single-layer PCB, double-layer PCB, multi-layer PCB,HDI and more… .
PCB Testing Equipment: AOI testing equipment, non-destructive testing equipment, measuring equipment and more… .
PCB Raw Materials and Chemicals: copper clad laminate（CCL）, copper electroplating liquid, etching liquid and more… .
PCB Dry and Wet Process Equipment: drilling machine, exposure unit, loader / unloader, electroplating line equipment and more… .
EAssembly Expo Taiwan
SMT equipment, testing equipment, materials, chemicals, consumptives.
SMT testing and inspection equipment, insert component assembly equipment and materials.
Semiconductor production equipment and materials, FPD production equipment and materials and more… .
Green Tech Expo Taiwan
Environmental Equipment and Material Manufacturing Industries.
Environmental equipment manufacturing industry, environmental material manufacturing industry.
Recycled Product Manufacturing Industries: recycled product manufacturing industry, Eco-friendly product manufacturing industry.
Environmental Technology Service Industries: environmental technology consulting industry, environmental engineering industry, environmental management technology.
Service industry, and other technology service industries.
Thermal Management Expo Taiwan
Thermal-module-related : thermal modules, heat pipes, fans, vapor chambers, heat sinks, thermal interface materials（TIM）,thermal.
Conductive substrate, thermoelectric coolers, thermal conductive powder, liquid cooling, micro motors, nanometer heat radiation coating, raw materials… .
Thermal Measurement and Modeling: thermal-measurement-related equipment, thermal design and analysis software… .
Packaging Expo Taiwan
Resin, Lead frame, Electronic conductive, gold wire / Bonding Wire, Auto Molding Equipment, Trim & Form Equipment, Package Sawing Equipment, Flip Chip, COFA.
Introduction: Exploring New Opportunities in Taiwan–Japan Semiconductor Collaboration
As global supply chains undergo a fundamental realignment, Taiwan and Japan have emerged as highly complementary partners in the semiconductor industry. To strengthen bilateral collaboration in this strategically vital sector—particularly in advanced packaging and high-end substrates—the Taiwan Printed Circuit Association (TPCA) is proud to host a two-day cross-industry engagement program in Kumamoto, Japan, from June 9 to 10, 2025. This program includes a golf networking event and the 2025 Taiwan High-Tech Forum-Japan, designed to deepen industrial dialogue and forge meaningful partnerships between Taiwanese and Japanese technology leaders.
Held on June 10 at the One Station Hotel in Kumamoto, the forum will spotlight cutting-edge developments in semiconductor and substrate supply chains. With a focus on technology convergence and supply chain resilience, the event features two core sessions:
Session I: Advanced Semiconductor Ecosystem — Highlighting innovations in heterogeneous integration, AI-era chip packaging, and the evolving frontiers of semiconductor manufacturing.
Session II: The Advantage of Taiwan’s Substrate Industry — Exploring Taiwan’s leadership in high-performance substrate materials, including ABF substrates and dry film photoresists, and their crucial role in next-generation packaging.
Through this forum, TPCA aims to facilitate knowledge exchange, technology synergy, and collaborative innovation across borders. We sincerely invite professionals from across the semiconductor value chain to join us in Kumamoto and explore the future of Taiwan–Japan cooperation in advanced electronics manufacturing.
Session I: Advanced Semiconductor Ecosystem
Dr. Kathy Yan（Director, TSMC）
From AI to Edge: Advanced packaging innovations and challengesDr. Yu-Po Wang（VP, SPIL）
Heterogeneous Packaging Integration for Industrial RevolutionMr. Kent Chen（Director, CSUN）
The technological development path of AI chips and advanced semiconductor packagingDr. Yu-Hua Chen（VP, Unimicron）
Advanced Substrate Trend for AI Computing System
Session II: The Advantage of Taiwan’s Substrate Industry
Mr. Wei-Ta Fu（Deputy Director, Nan Ya）
Challenge of High Performance ABF SubstrateMr. Gary Cheng（Assistant Manager, EMC）
EMC Substrate Material Development for Advanced PackagingDr. Fumin Chou（Deputy Manager, Eternal）
Challenges of dry film photoresist in next-generation package substrates
TSMC
TSMC is the world’s largest and most advanced semiconductor foundry, providing cutting-edge logic process technologies and leading the industry in advanced packaging solutions such as CoWoS and SoIC. It serves global semiconductor leaders in AI, mobile, HPC, and automotive sectors.
SPIL
SPIL is a global leader in semiconductor assembly and testing services. The company specializes in a wide range of advanced packaging technologies, including flip-chip, fan-out, and heterogeneous integration, supporting major chipmakers in delivering high-performance and compact solutions.
CSUN
CSUN is a key semiconductor backend equipment and materials provider based in Taiwan. It focuses on process development and equipment for advanced packaging, particularly in support of AI chips, high-density interconnects, and new semiconductor integration technologies.
Unimicron
Unimicron is one of the world’s leading manufacturers of printed circuit boards (PCBs) and IC substrates. The company plays a critical role in advanced substrate innovation for AI computing, HPC, and next-generation semiconductor packaging, enabling fine-line, high-layer-count, and high-frequency substrate solutions.
Nan Ya PCB Corporation
Nan Ya PCB, a subsidiary of Formosa Plastics Group, is a major global supplier of ABF substrates and HDI (High-Density Interconnect) PCBs. The company focuses on developing high-performance substrate solutions for advanced packaging applications, particularly for servers, networking, and AI chips.
EMC (Elite Material Co., Ltd.)
Elite Material is a leading Taiwanese manufacturer of substrate and PCB materials, known for its high-speed, low-loss laminate solutions. EMC is actively developing next-generation materials to support advanced packaging, enabling reliable performance in high-frequency and high-bandwidth environments.
Eternal Materials Co., Ltd.
Eternal is a key player in photoresist, dry film, and electronic chemical materials for semiconductors and PCBs. The company is focused on addressing challenges in next-generation packaging substrates, offering dry film photoresists that support finer patterns, better resolution, and improved reliability in advanced manufacturing.
