ADVANCED PACKAGING: Chip First vs Chip last

1) Chip First: Die » RDL
2) Chip Last: RDL » Die

Chip-First processes enables high-density wiring without the influence of factors such as warping, as the wiring process is completed on the carrier, and the overall package thickness can be kept very low. It is often used in high-value chips such as high-end mobile phone processors. The downside is that th…