ADVANCED PACKAGING: TSMC CoWoS vs. CoWoS-like Solution
Due to TSMC’s CoWoS Capacity Being at Full Load, since TSMC's CoWoS capacity has long been at full load and even with this year’s expansion, the main priority is reserved for NVIDIA, market analysts indicate that TSMC continues to increase CoWoS capacity to meet AMD's demand.
However, establishing a new production line takes six to nine months, leading to expectations that AMD will seek partnerships with other manufacturers capable of CoWoS-like packaging. ASE Technology, Amkor, Powertech , and KYEC are the first potential partners.
TSMC has been outsourcing part of CoWoS for some time, primarily focusing on small-batch, high-performance chips. CoW remains TSMC's in-house production, while the later-stage WoS is outsourced to OSAT companies to enhance production efficiency and flexibility. This model will continue in the future 3D IC era.
Both ASE and Amkor have undertaken WoS orders since last year. ASE has strengthened its development of advanced packaging technology, already possessing a complete solution for the entire CoWoS process. The company is actively attracting customers and striving to meet demands. ASE also stated that it sees strong AI potential and expects related revenue to double in 2024.
Packaging Technology Comparison of ASE and TSMC
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We are engineers from Taiwan's semiconductor industry with profound expertise in advanced processes and advanced packaging. Our team has in-depth knowledge of AI chips, advanced packaging, CoWoS, SoIC, and Silicon Photonics (PIC).
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