AI Joins the 3nm Battle: TSMC Receives a Surge of Orders!
TSMC's Expanding Global 3nm Manufacturing Capacity and Strategic Investments
A List of TSMC 3nm Customers and Products
As AI chips join the 3nm battle, they will consume even more foundry capacity, especially in the area of advanced packaging. Currently, chips like Nvidia's B200, AMD's MI300, or Intel's Gaudi 3, use CoWoS packaging that is 3.3 times the size of TSMC's reticle, allowing for only around 16 chips to be cut. In the f…