Amkor and TSMC expand their partnership for Advanced Packaging collaboration in Arizona
Provide more comprehensive services to U.S. customers
TSMC, the leading wafer foundry, announced in a press release on the 4th that it has signed a MOU with Amkor Technology, Inc., a major player in the packaging and testing industry. The collaboration will provide advanced packaging services at TSMC's Arizona facility, further expanding the local semiconductor ecosystem.
Under this agreement, T…