Amkor's New Advanced Packaging Technology
Leading the evolution of new packaging technologies
The advanced packaging trend in the semiconductor industry is increasingly focusing on improving die-to-die (D2D) connections through innovations like 2.5D TSV, S-SWIFT™, and 3DIC packaging. These technologies enable higher integration of multiple logics, DRAM, and HBM while enhancing thermal management and power distribution.
Techniques such as μ-bump …