ASE’s Next Generation of 3D Heterogeneous Integration
VIPack™, an advanced packaging platform
ASE offers high-density packaging solutions that include three major categories: Flip Chip Ball Grid Array (FCBGA), Fan Out Chip-on-Substrate (FOCoS), FOCoS-Bridge, and 2.5D packaging.
The integration of interconnect lines between chips in FCBGA packaging is achieved through the BGA substrate, where the minimum line width/line spacing (L/S) …