IEEE OIP Forum — Where the Future of Optical Interconnects Begins. Unite. Innovate. Scale.
Original Articles By SemiVision Research (IEEE OIP)
Next-Generation Connectivity: Innovations in SerDes, Photonics, and Packaging
The IEEE Optical Interconnects and Packaging (OIP) Forum is a must-attend conference for anyone shaping the future of optical systems.
Bringing together world-class experts in photonic integration, high-speed I/O, and advanced packaging, OIP is the definitive platform for driving innovation at the intersection of bandwidth, power, and scalability.
IEEE Optical Interconnects and Packaging (OIP) Conference
Date & Venue: June 16–18, 2025 // The Elizabeth Hotel, Fort Collins, Colorado, USA
Why OIP Matters
As AI, high-performance computing (HPC), and data-intensive applications continue to push the limits of digital infrastructure, traditional electrical interconnects are becoming a critical bottleneck. The IEEE OIP Conference addresses this urgent challenge by spotlighting groundbreaking technologies in 3D photonics, Co-Packaged Optics (CPO), and silicon photonics integration—advancing the path toward interconnects with <3 pJ/bit energy consumption and terabit-scale bandwidth per link.
A Unique Single-Track, Cross-Disciplinary Forum
OIP is not just another conference. It is a single-track, deeply collaborative platform that unites top experts from diverse domains—photonic devices, advanced packaging, high-speed SerDes, I/O, sockets, and interconnects. Unlike fragmented multi-track conferences, OIP fosters high-quality technical discussions through curated invited talks, expert panels, and focused workshops—all under one roof, ensuring maximum cross-pollination of ideas.
From Research to Real-World Impact
OIP bridges academia and industry, creating a space where advanced research meets cutting-edge deployment. Esteemed speakers such as Ola Tørudbakken (Meta) and Near Margalit (Broadcom) will deliver keynotes on the future of optical interconnects in hyperscale environments. The agenda includes deep dives into light sources, materials, heterogeneous integration, 2.5D/3D packaging, CPO architecture, and AI-driven design workflows.
Empowering the Next Generation
The conference offers dedicated tracks for student posters, early-career presentations, and startup showcases, providing rising researchers and innovators with direct access to decision-makers in industry. This commitment to talent development ensures the continued vitality of the optical interconnect ecosystem.
Key Themes and Technical Highlights
AI-Driven Optical Interconnects
Strategies for scaling SerDes to 200G/400G and addressing AI data center demands for bandwidth, latency, and energy efficiency.
Co-Packaged Optics & 3D-IC Integration
Architectural and packaging techniques to optimize density, performance, and thermal management.
Next-Generation Photonic Devices & Materials
Integration of III-V lasers, frequency combs, quantum dot emitters, and silicon photonics for scalable solutions.
High-Volume Manufacturing & Testing
Practical frameworks for testing CPO modules, ensuring connector interoperability, serviceability, and reliability.
Workshops & Industry Dialogues
Topics range from standards development, safety and reliability assurance, to AI-assisted design and simulation tools. Direct academia-industry exchanges are facilitated through curated panels and interactive sessions.
Join Us to Shape the Future
In an era defined by exponential data growth and performance scaling, the OIP Conference offers a rare opportunity to align photonic and packaging innovation with the real-world needs of hyperscale computing and AI workloads. Through focused collaboration and technical excellence, OIP serves as a catalyst for the next wave of interconnect solutions.
We invite you to join us in Fort Collins to engage, learn, and lead the transformation of next-generation optical-electrical systems.
Mission of the IEEE Optical Interconnects and Packaging (OIP) Conference
We unite experts from multidisciplinary fields in a focused, single-track environment to collaboratively solve the pressing challenges shaping the future of interconnects and electro-optical packaging. Our mission spans across the critical domains of:
Photonic Devices
Drawing insights from leading-edge conferences such as IPC, OFC, and ECOC.
Optical Interconnects & Packaging
Advancing integration strategies through contributions at OFC and ECTC.
Electronic Packaging
Exploring next-generation architectures and materials via ECTC and DesignCon.
SerDes & High-Speed I/O
Bridging signal integrity and bandwidth innovation at ISSCC and DesignCon.
Sockets and Connectors
Driving mechanical and electrical interface evolution at ECTC and DesignCon.
Through cross-disciplinary engagement and deep technical exchange, we aim to accelerate innovation and create a robust foundation for the next era of computing and connectivity.
OIP 2025 – Featured Invited Speakers
The IEEE Optical Interconnects and Packaging (OIP) Conference focuses on the future of optical-electrical integration and advanced packaging. In 2025, OIP brings together a world-class lineup of invited speakers from both industry and academia, who will share cutting-edge research, practical experience, and insights into next-generation system architectures.
Key Invited Speakers
Barak Freedman (NVIDIA, Israel)
Senior Director of Product Engineering at NVIDIA, specializing in ultra-high-speed interconnect architectures. He brings hands-on expertise in advanced SerDes and I/O systems.
Tony Chan Carusone (Alphawave Semi / University of Toronto)
CTO of Alphawave Semi and Professor at the University of Toronto, renowned for his work in high-speed communications ICs and advanced SerDes design, bridging academia and industry.
Sajjad Moazeni (University of Washington, USA)
Assistant Professor focusing on electronic-photonic co-design, packaging, and system-level integration for AI and HPC applications.
Mike Li (Intel Fellow, USA)
Intel Fellow with deep experience in processor interconnects, packaging, and photonic integration—driving the convergence of semiconductor and photonics.
Akihiro Noriki (AIST, Japan)
Senior Researcher at AIST, engaged in fundamental research on photonic packaging and fabrication processes with insights into standardization and high-volume manufacturing.
Marcello Girardi (Iloomina, Sweden)
Co-founder and CEO of Iloomina, developing disruptive photonic systems and bringing them into commercial applications.
Rebecca K. Schaevitz (Mixx Technologies, USA)
Chief Product Officer at Mixx Technologies, working on reconfigurable photonic systems for data centers and edge computing.
Joaquin Matres (GDSFactory, USA)
Founder of GDSFactory, delivering open-source photonic IC design platforms to accelerate market access and innovation.
Kevin Dezfulian (GlobalFoundries, USA)
Distinguished Engineer at GlobalFoundries with expertise in semiconductor packaging and photonic I/O integration for high-volume deployment.
Lenin Patra (Marvell Semiconductor, USA)
Technical Director at Marvell, leading efforts in chip integration, packaging, and high-performance I/O module development.
Vivek Raghunathan (Xscape Photonics, USA)
Co-founder and CEO of Xscape Photonics, advancing tunable silicon photonics for scalable optical solutions.
Lucas Yeary (Corning Inc., USA)
Engineer and manager at Corning, focusing on the development of optical fiber and connector materials and manufacturing.
Yang Chen (Senko Advanced Components, USA)
Senior R&D Manager at Senko, specializing in high-performance optical connectors and interface reliability.
Hamidreza Aghasi (University of California, Irvine, USA)
Assistant Professor researching hardware-photonics integration, with a focus on packaging innovations and co-design.
Nicole Heidel (SRI International, USA)
Project Manager at SRI International, coordinating large research-to-industry collaborations on scalable photonic packaging.
Gordon Morrison (Freedom Photonics & EM4, USA)
VP of Engineering, with a focus on high-speed transmitter/receiver packaging and system-level photonic integration.
Molly Piels (OpenLight, USA)
Senior Engineer at OpenLight, working on integrated photonics systems and innovative module designs.
Luke Graham (Dallas Quantum Devices, USA)
CTO of DQD, pioneering quantum photonic components and advanced optical communication architectures.
Yoojin Ban (imec, Belgium)
Program Manager for Optical I/O at imec, leading efforts in standardization and efficient silicon photonics packaging.
Jacob Scheuer (Tel Aviv University, Israel)
Professor specializing in photonic chips and emerging interconnect architectures.
Darius Bunandar (Lightmatter, USA)
Chief Scientist at Lightmatter, driving optical computing architectures for AI acceleration.
Srinivas Venkataraman (Meta, USA)
Senior Hardware Engineer at Meta, sharing experience in deploying large-scale optical systems in data centers.
Dusan Gostimirovic (PreFab Photonics / McGill University, Canada)
Co-founder of PreFab Photonics and postdoctoral researcher at McGill, focusing on scalable photonics process development.
Preet Virk (Celestial AI, USA)
Co-founder and COO of Celestial AI, leading optical-memory decoupling strategies for AI infrastructure.
Anand Ramaswamy (Broadcom, USA)
Solution Marketing Manager at Broadcom, facilitating product strategy and market adoption for optical innovations.
Samir Chaudhry (Tower Semiconductor, USA)
VP of Design Enablement, specializing in photonics foundry flows and customer integration at Tower Semi.
John Shalf (LBNL, USA)
Division Chief at Lawrence Berkeley National Laboratory, leading photonics adoption in future exascale systems.
Surya Bhattacharya (IME, Singapore)
Director of System-in-Package at A*STAR’s IME, focusing on heterogeneous integration and advanced packaging.
Erman Timurdogan (Lumentum, USA)
Director of Silicon Photonics R&D, developing advanced photonic devices and integrated platforms.
Farhang Yazdani (BroadPak Corporation, USA)
CEO and CTO of BroadPak, leading commercialization of advanced packaging and high-density integration.
Matt Traverso (Marvell Technology, USA)
Distinguished Engineer at Marvell, focusing on high-frequency packaging and chip-system integration.
Dan Kuchta (NVIDIA, USA)
Hardware System Architect at NVIDIA, engaged in GPU design and optoelectronic accelerator architecture.
Stephen E. Ralph (Georgia Tech, USA)
Professor researching system-scale photonic architectures and optical-electronic integration strategies.
Bassem Tossoun (Hewlett Packard Labs, USA)
Senior Research Scientist, exploring enterprise-grade photonic system prototyping and deployment.
John Jost (Enlightra, Switzerland)
Co-founder and CEO of Enlightra, leading next-generation frequency comb-based photonic computing systems.
Mihai Vidrighin (PsiQuantum, USA)
Senior Director of Photonic Circuits at PsiQuantum, developing scalable quantum photonic platforms.
Adam Healey (Broadcom, USA)
Senior R&D Leader in physical layer systems, focusing on high-speed optical-electrical PHY integration.
Hang Jin (MaxLinear, USA)
Director of Engineering overseeing SoC-level photonic packaging, validation, and testing.
Christopher Striemer (AIM Photonics, USA)
Ph.D. in packaging and testing at AIM Photonics, specializing in high-throughput photonic packaging workflows and reliability assurance.
For more details, please refer to the official website ：
https://oip-conference.org/program
A World-Class Roster Driving Innovation
These distinguished speakers represent the full spectrum of the optical-electrical ecosystem—from device and chip development to system integration and market deployment. With backgrounds spanning NVIDIA, Intel, Meta, Broadcom, IBM, Google, Corning, PsiQuantum, and many more, they offer attendees unparalleled insights into the future of high-bandwidth, low-power interconnects and scalable packaging solutions.
Through this curated lineup, OIP 2025 serves as a launchpad for the next era of co-packaged optics, silicon photonics, and AI-scale system design.
Featured Institutions Represented by Invited Speakers at IEEE OIP 2025
AIM Photonics – A U.S. national photonics manufacturing institute advancing cutting-edge packaging and testing platforms.
AIST (National Institute of Advanced Industrial Science and Technology, Japan) – A leading Japanese R&D organization specializing in photonic fabrication and system-level integration.
Alphawave Semi – A global leader in high-speed SerDes and interconnect technologies.
BroadPak Corporation – A provider of high-density advanced packaging solutions focused on 2.5D/3D heterogeneous integration.
Broadcom – A core chipset supplier for global data center and telecommunications infrastructure.
Celestial AI – A pioneer in photonic fabric technology, aiming to decouple memory and compute for next-generation AI systems.
Corning Inc. – A global leader in optical fiber and advanced materials supporting high-speed connectivity infrastructure.
Dallas Quantum Devices – An emerging developer of quantum photonic components and architectures.
Enlightra – A Swiss startup specializing in frequency combs and photonic computing systems.
Freedom Photonics & EM4 – Key suppliers in high-speed photonic transmission and optoelectronic packaging.
GDSFactory – The leading open-source platform for photonic IC design, enabling automated and reusable module workflows.
Georgia Tech – A top U.S. research university with strong expertise in scalable photonic architectures and high-speed communication.
GlobalFoundries – A major global semiconductor foundry, actively integrating photonic processes into manufacturing.
Hewlett Packard Labs – The advanced research division of HP, focusing on photonic system prototyping and AI infrastructure.
Iloomina – A Swedish startup developing modular and commercially deployable photonic systems.
imec (Belgium) – A world-renowned research center in nanoscale fabrication and silicon photonics integration.
IME (Singapore) – A research institute under A*STAR, focused on heterogeneous integration and advanced system-in-package solutions.
Intel – A global semiconductor leader continuously innovating in photonic packaging and system architectures.
Lawrence Berkeley National Lab (LBNL) – A U.S. national lab leading photonics architecture research for future HPC and exascale systems.
Lightmatter – A trailblazer in photonic processors for AI workloads, developing hybrid compute architectures.
Lumentum – A key supplier of high-speed optical components and modules, advancing silicon photonics platforms.
Marvell Semiconductor / Marvell Technology – Providers of high-performance SerDes, packaging, and cloud-scale system solutions.
MaxLinear – An expert in SoC and mixed-signal integration, expanding into high-speed packaging domains.
McGill University – A top Canadian university actively engaged in photonic process R&D and industry collaboration.
Meta – A global leader in AI and hyperscale data center development, driving deployment of large-scale optical systems.
Mixx Technologies – A U.S.-based startup focused on reconfigurable photonic modules for data and edge applications.
NVIDIA – The global leader in AI/HPC computing platforms, heavily investing in CPO and optoelectronic integration.
OpenLight – A company advancing integrated silicon photonics platforms for diverse system applications.
PreFab Photonics – A startup focused on rapid prototyping and manufacturable photonic circuits.
PsiQuantum – A leading developer of scalable quantum photonic computing platforms.
Senko Advanced Components – A high-performance optical interconnect and connector technology provider.
SRI International – A leading U.S. research organization focusing on photonic packaging and manufacturability strategies.
Tel Aviv University – A top Israeli university with cutting-edge research in photonic chips and future communication systems.
Tower Semiconductor – A major foundry providing photonics wafer services and custom process integration.
University of California, Irvine / Georgia Tech / University of Toronto / University of Washington / McGill / Tel Aviv – Internationally renowned universities with comprehensive expertise spanning materials, packaging, silicon photonics, and system design.