Introduction of TSMC CoWoS-R Packaging
CoWoS® Platform for AI HPC Packaging
At the 2024 Taiwan Semicon Forum, senior executives from TSMC frequently discussed advanced packaging, with a focus on two key technologies: CoWoS and SoIC.
To start, CoWoS package involves a "horizontal placement" approach, while SoIC focuses on "vertical stacking." Advanced packaging can first employ CoWoS for horizontal placement and then …