Kumamoto Rising: Taiwan-Japan Synergy in the Next Semiconductor Frontier
Original Article by SemiVision Research (TPCA , TSMC ,TSMC (via JASM), SPIL, Unimicron, Elite Material Co., Ltd. , Nanya, Eternal , CSUN)
Nestled in the heart of Kyushu, Kumamoto is emerging as a new epicenter of semiconductor innovation. With TSMC’s first chip plant in Kikuyō now in full operation using 12–28 nm technologies—and construction of its second, more advanced 6 nm fab well underway—this region is undergoing a dramatic transformation .
Hosted by TPCA Japan, today’s Kumamoto Taiwan High‑Tech Forum on June 10, 2025 brought together industry leaders including TSMC , SPIL, Unimicron, Elite Material Co., Ltd. , Nanya, Eternal and CSUN. Through a series of in‑depth keynote presentations, panel discussions, and technical exchanges, the forum spotlighted Kumamoto’s strategic rise as a vital hub in the Taiwan‑Japan semiconductor value chain—setting the stage for new partnerships in high‑tech manufacturing and material innovation.
The TPCA Taiwan-Japan Tech Forum has provided updated insights into the latest industry developments.
In the context of Taiwan-Japan semiconductor collaboration, several key roles have emerged:
First-time Forum & Exploration of Partnership Opportunities:
This marks the first time the Taiwan Printed Circuit Association (TPCA) has hosted a forum in Kumamoto, Japan. The primary objective is to create a platform for participants to jointly explore potential areas of collaboration between Taiwan and Japan in the semiconductor sector. This demonstrates both sides’ strong willingness to deepen their partnership.
Attracting Strong Interest and Facilitating Exchange
This forum drew over a hundred prominent representatives from Taiwan and Japan’s industry sectors. Their enthusiastic participation not only underscores the high level of attention and commitment to bilateral collaboration but also highlights the forum’s role as a vital platform for in-depth dialogue and shared engagement between the two nations.
Building a Collaborative Bridge and Advancing Technology
The forum is clearly positioned as a "bridge for cooperation", aiming to foster close industrial interaction between Taiwan and Japan. It seeks to elevate technological capabilities and jointly create new commercial opportunities, underlining its critical role in promoting tangible cooperation and innovation.
Addressing Industry Transformation and Enhancing Strategic Positioning
Amid the global restructuring and upgrading of the semiconductor and electronics industries—driven by AI computing convergence and advanced packaging—the forum emphasized that both Taiwan and Japan hold complementary strategic advantages. A united front would further strengthen their leadership position in this evolving landscape.
Sharing Technical Expertise and Promoting Industry Linkages
The forum featured technical experts from leading companies such as TSMC, Unimicron, HannStar, Kinsus, and Eternal Materials, who shared hands-on insights and forward-looking perspectives in integrated packaging, process technology, material innovation, and real-world applications. These knowledge exchanges help deepen cross-border technological collaboration and foster supply chain integration.
Widespread Support
The successful execution of the forum was strongly supported by various organizations from both countries, including the Taipei Computer Association, Japan Electronics Packaging and Circuits Association (JPCA), Kyushu Semiconductor Innovation Association (SIQ), and key strategic enterprises like Unimicron, Taiwan PCB Techvest, Eternal Materials, Taimide, and HannStar Board. This reflects the high value the industry places on this cooperative platform.
This forum plays a pioneering role in the Taiwan–Japan semiconductor collaboration. It serves as a platform for exchange, facilitates technical sharing, and helps uncover future business opportunities. Ultimately, it aims to strengthen the strategic partnership and competitive edge of both sides in an ever-evolving global semiconductor landscape.
Date: October 22 (Wed.) - October 24 (Fri.), 2025
Time: 10:00-17:00 (Closing one hour early on the last day)
Place: TaiNEX, TAIPEI
Contact: Ms. Lynn #302 / Ms. Kate #305
TEL：+886-3-3815659
E-mail：show@tpca.org.tw
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The opening session featured a keynote speech by Kathy Yen, Director of R&D at TSMC. Her presentation was highly informative, covering a wide range of topics related to the future development of AI. She discussed the applications of edge AI and shared her insights on TIM (Thermal Interface Materials). Kathy Yen also emphasized the importance of CoWoS technology and offered her perspectives on the future of advanced packaging.
Presentation Topic and Background:
The speaker, Dr. Kathy Yen, is from TSMC’s New Technology and Advanced Packaging & Testing System Integration Division.
For Paid Members, SemiVision will provide a focused summary of the keynote presentations delivered by the seven featured companies at this forum. In the coming days, we will publish dedicated overviews highlighting the key insights and strategies shared by each company.
