NVIDIA-Driven Demand Spurs TSMC’s Advanced Packaging Expansion Amid CoWoS Boom
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CoWoS Capacity Set to Skyrocket by 2026: Massive Growth in Advanced Packaging
Total CoWoS Capacity (WPM= Wafer Per Month):
2023: 13,000 ~ 16,000 WPM
2024: 35,000 ~ 40,000 WPM
2025e: 65,000 ~ 75,000 WPM
2026e: 90,000 ~ 110,000 WPM