Nvidia’s Update on TSMC’s Advanced Packaging - CoWoS and SoIC
Discussion on Chip Design and Packaging of Broadcom, AWS, AMD, Intel, and Nvidia
Recently, there has been a lot of discussion around CoWoS capacity, and the SemiVision team released its CoWoS capacity forecast on December 31, 2024.
Capacity Forecast — 2024 to 2026
By the end of 2024, monthly capacity is estimated at 40K wafers per month.
By the end of 2025, this is expected to increase to around 65K wafers per month.
However, it’s important to understand that capacity ramp-up doesn’t happen all at once. It’s a gradual process, with several key phases, including:
Tool installation
Equipment qualification
Risk production runs
Recipe fine-tuning
In addition to TSMC, Google and Marvell are also building their own capacities. However, NVIDIA will continue to dominate the market.
2025 CoWoS Average Monthly Capacity Estimation
2026 CoWoS Average Monthly Capacity Estimation
Here’s a breakdown of CoWoS type by customer type
Related Article: The Rise of ASIC: Custom Chips Becoming a Key Trend!
SemiVision Research Report - Summary of TSMC’s Overall Advanced Packaging Situation:
TSMC CoWoS Roadmap
TSMC SoIC Roadmap
GUC GLink-3D interface
