SK Hynix Leads in HBM4 Progress, Expected to Begin Mass Production in 2H25

The Most Expensive Essential in AI Chips: HBM

The supply situation for the next-generation HBM4 will primarily hinge on the uncertainty surrounding Samsung's development progress. Notably, SK Hynix has publicly announced that HBM4 will continue to utilize the MR-MUF stacking method. The most significant difference between HBM4 and previous versions of HBM lies in the base die process. Instead of th…