Towards the Core of AI: MediaTek’s Transformation Journey and Key Strategies at Computex 2025
Original Article by SemiVison Research (TSMC , Nvidia , MTK)
MediaTek COMPUTEX 2025 Keynote Summary
Speaker: Rick Tsai, Chairman and CEO
Topic: Comprehensive AI Deployment — From Edge to Cloud
MediaTek’s Transformation Journey: From Wi-Fi Chips to the AI Era
MediaTek (MTK), founded in 1997, began as a provider of optical disk drive controller chips. It later gained prominence through its wireless connectivity solutions and mobile system-on-chip (SoC) products. As the smartphone market matured, MediaTek actively sought to diversify into new verticals—such as automotive electronics, the Internet of Things (IoT), and edge AI—in an effort to reposition itself for the AI era. The following sections outline five key dimensions through which MediaTek has evolved from its original Wi-Fi and mobile SoC-centered business model into a company strategically aligned with the demands of the AI age.
Expanding Its Business Landscape: From Wi-Fi and Mobile SoCs to Automotive, IoT, and Edge AI
In its early years, MediaTek’s core business revolved around wireless connectivity chips—such as Wi-Fi—and mobile application processors. The company significantly strengthened its position in wireless technology through strategic moves like the acquisition of Ralink in 2011. In recent years, it even secured Wi-Fi chip orders for Apple TV, underscoring its competitiveness in the connectivity space.
On the mobile front, MediaTek’s Helio and Dimensity SoC series provided cost-effective and high-performance solutions for a wide range of smartphones, earning the company a reputation as the “King of China’s Shanzhai phones” during the early smartphone boom. However, as growth in the mobile device market began to plateau, MediaTek began redirecting its R&D efforts toward emerging sectors to sustain long-term momentum.
IoT and Edge AI: Building an Intelligent, Connected Ecosystem
As the Internet of Things (IoT) and smart devices gained traction, MediaTek committed itself to developing AIoT platforms that integrate artificial intelligence into connected environments. In 2018, the company launched its NeuroPilot AI platform, which incorporates a dedicated AI Processing Unit (APU) and a complete software development kit within its smartphone SoCs. This platform was designed to enable on-device AI processing across a wide range of endpoints—including smartphones, smart homes, and even autonomous vehicles.
Following the NeuroPilot debut, MediaTek introduced the Genio series AIoT chips, enhancing core connectivity capabilities such as Wi-Fi, GPS, and Bluetooth. These solutions are tailored to meet the demands of industrial, commercial, and consumer-grade IoT applications by delivering high performance with ultra-low power consumption.
The NeuroPilot platform allows developers to efficiently deploy mainstream AI models across MediaTek’s chip portfolio, fostering a broad and scalable edge AI ecosystem. MediaTek has emphasized that its flagship smartphone chips now feature industry-leading AI acceleration. For example, the Dimensity 9300+—unveiled in 2024—boasts a Neural Processing Unit (NPU) capable of delivering 68 TOPS, enabling real-time generative AI tasks and intelligent assistant functionalities directly on the device. Smartphones powered by these chips have become powerful edge AI engines, capable of tasks such as content creation, real-time translation, and context-aware personal interactions.
For Paid Members, SemiVision will discuss topics on
Entering the Automotive Electronics Market: From Infotainment to Full-Stack Vehicle Intelligence
Entering the AI ASIC Market: Collaboration with NVIDIA and Strategic ASIC Roadmap
Partnership with NVIDIA: From Automotive to Cloud AI
Custom ASIC Design Strategy
Strategic Significance in MTK Custom ASIC Service
Expanding into Cloud AI: NVLink Fusion and the Co-Design of GB10 Superchip
High-Speed SerDes Deployment: From 112G to 224G
Evolution of Advanced Packaging Technologies: From Standard to 2.5D, 3D, and 3.5D Integration
Strategic Collaborations and Manufacturing Readiness in Advanced Package
Transformation in the AI Era: MediaTek’s Rise in Market Position and Technological ReputationExpanding Market Position: From Smartphones to Cloud and Automotive AI
Boosting Investor Confidence Through Strategic Clarity
Commercializing 2nm: A Milestone in Advanced Node Leadership
Continued Expansion of Edge AI Devices: From Dimensity to Chromebook, IoT, and Automotive Platforms
Advanced Packaging and High-Speed I/O: Comprehensive Evolution
Technical Milestones and Future Outlook