The 3DFabric Alliance is the first of its kind in the semiconductor industry and aims to achieve the following goals with the collaborative efforts of our OIP (Open Innovation Platform) ecosystem partners:
Accelerate 3DFabric ecosystem innovation and readiness
Speed up 3DFabric customer adoption and production
Lead industry in system design by integrating advanced logic with 3DFabric technologies to provide a full spectrum of best-in-class solutions and services for semiconductor design, memory modules, substrate technology, testing, manufacturing, and packaging.
Who join TSMC 3DFabric Alliance in 2024
EDA: Keysight
IP: ProteanTecs
Substrate: Toppan
Testing: Keysight
What is 3D Fabric?
TSMC-SoIC: Provides front-end, 3D inter-chip (3D IC) stacking technologies for re-integration of chiplets partitioned from a SoC. The resulting integrated chip outperforms the original SoC in system performance. It also affords the flexibility to integrate additional system functionalities. SoIC is fully compatible with CoWoS and InFO, which can provide a powerful solution.
CoWoS: Chip-on-Wafer-on-Substrate is a 2.5D wafer-level multi-chip packaging technology. There are three different types of CoWoS: CoWoS-S, CoWoS-R and CoWoS-L.
InFO: Fan-Out wafer level packaging is a wafer level system integration technology platform, featuring high density RDL and TIV for high-density interconnect and performance.
To learn more, we will discuss more 3D Fabric packaging Techonology in the future.
About Semi Vision
We are engineers from Taiwan's semiconductor industry with profound expertise in advanced processes and advanced packaging. Our team has in-depth knowledge of AI chips, advanced packaging, CoWoS, SoIC, and Silicon Photonics (PIC).
Additionally, we possess expertise in semiconductor materials, specialty chemicals, and the semiconductor supply chain.
We will periodically provide articles sharing insights into the semiconductor industry with fellow enthusiasts. If you have any questions regarding semiconductors, feel free to reach out to us.