TSMC CoWoS Development Trend
CoWoS-S, CoWoS-R, CoWoS-L, Who will be the mainstream in the future?
We can see CoWoS-S shows a significant decrease from 68% in 2024 to 30% in 2026. CoWoS-L experiences strong growth, rising from 24% in 2024 to 65% in 2026. CoWoS-R remains relatively low and declines slightly over time, from 8% in 2024 to 5% in 2026.
CoWoS Distribution in 2024E, 2025E and 2026E
The CoWoS-S packaging faces limitations due to its smaller silicon interposer size, restricted to less than three reticles. This constraint hampers its ability to support the increasing number of chips and larger areas required for advanced semiconductor applications, such asChiplet designs.
In contrast, CoWoS-L is engineered to address these needs, offering a larger substrate size of 4 to 10 reticles. This allows for more die to be implemented on the substrate, making CoWoS-L ideal for next-generation, high-density packaging solutions that align with the trend toward larger areas and increased chip integration.
What is CoWoS-S, CoWoS-R, CoWoS-L?
We will discuss more topics from this article
CoWoS-S Roadmap/Process/ Challenges
CoWoS-R Roadmap/Process/ Challenges
CoWoS-L Roadmap/Process/ Challenges
About Semi Vision
We are engineers from Taiwan's semiconductor industry with profound expertise in advanced processes and advanced packaging. Our team has in-depth knowledge of AI chips, advanced packaging, CoWoS, SoIC, and Silicon Photonics (PIC).
Additionally, we possess expertise in semiconductor materials, specialty chemicals, and the semiconductor supply chain.
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