Scaling to Meet the AI Era: TSMC’s Global Capacity Expansion and Manufacturing Excellence
Original Article by SemiVision Research (TSMC)
TSMC 2025 Manufacturing and Technology Progress Summary
Advanced Logic Manufacturing
Continuous Defect Density Improvement to Accelerate Customer Time-to-Volume Competitiveness
TSMC continues to demonstrate strong manufacturing maturity, with the defect density of its N6, N7, and N4 technologies successfully reduced to levels comparable to previous nodes. This extends TSMC’s proven learning curve in technology transitions, ensuring that customers’ new product development cycles are not constrained by yield bottlenecks.
Since entering risk production, the N2 process has shown defect density improvement progress consistent with the historical trends of N7, N5, and N3 nodes, reflecting steady process advancement. Based on current assessments, N2 is on track to enter volume production by the end of 2025, achieving yield levels at ramp-up that are capable of supporting advanced AI, high-performance computing (HPC), and mobile applications.
For Paid Members, SemiVision will discuss topics on
Automotive-Grade Quality Achievements Enabling High-Growth Applications
Diversified Advanced Node Roadmap to Meet Market-Specific Needs
More than Moors’s Vision in Specialty Technologies
Capacity Expansion and Global Footprint
Accelerating Global Fab Construction and Localization Strategy
Production Consistency Across Global Fabs
Achieving Consistent Global Production Quality
3D Fabric™ Manufacturing & Expansion
Comprehensive 3D Fabric™ Technology Portfolio
Capacity Expansion and Growth Momentum in Advanced Package
Smart Manufacturing and Automation Upgrades
Enabling Heterogeneous Integration and System-Level Innovation
Green Manufacturing in TSMC
Taiwan’s Leadership in Demonstration of Carbon Capture Technologies
Green Building and Sustainable Operations Certification
Conclusion & Outlook