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Scaling to Meet the AI Era: TSMC’s Global Capacity Expansion and Manufacturing Excellence
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Scaling to Meet the AI Era: TSMC’s Global Capacity Expansion and Manufacturing Excellence

Original Article by SemiVision Research (TSMC)

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SEMI VISION
May 17, 2025
∙ Paid
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SEMI VISION
Scaling to Meet the AI Era: TSMC’s Global Capacity Expansion and Manufacturing Excellence
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TSMC 2025 Manufacturing and Technology Progress Summary

Advanced Logic Manufacturing

Continuous Defect Density Improvement to Accelerate Customer Time-to-Volume Competitiveness

Behind the Yield: Exploring D₀ Challenges in TSMC × NVIDIA AI Chip Production

Behind the Yield: Exploring D₀ Challenges in TSMC × NVIDIA AI Chip Production

SEMI VISION
·
May 7
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TSMC continues to demonstrate strong manufacturing maturity, with the defect density of its N6, N7, and N4 technologies successfully reduced to levels comparable to previous nodes. This extends TSMC’s proven learning curve in technology transitions, ensuring that customers’ new product development cycles are not constrained by yield bottlenecks.

Since entering risk production, the N2 process has shown defect density improvement progress consistent with the historical trends of N7, N5, and N3 nodes, reflecting steady process advancement. Based on current assessments, N2 is on track to enter volume production by the end of 2025, achieving yield levels at ramp-up that are capable of supporting advanced AI, high-performance computing (HPC), and mobile applications.

For Paid Members, SemiVision will discuss topics on

  • Automotive-Grade Quality Achievements Enabling High-Growth Applications

  • Diversified Advanced Node Roadmap to Meet Market-Specific Needs

  • More than Moors’s Vision in Specialty Technologies

  • Capacity Expansion and Global Footprint

  • Accelerating Global Fab Construction and Localization Strategy

  • Production Consistency Across Global Fabs

  • Achieving Consistent Global Production Quality

  • 3D Fabric™ Manufacturing & Expansion

  • Comprehensive 3D Fabric™ Technology Portfolio

  • Capacity Expansion and Growth Momentum in Advanced Package

  • Smart Manufacturing and Automation Upgrades

  • Enabling Heterogeneous Integration and System-Level Innovation

  • Green Manufacturing in TSMC

  • Taiwan’s Leadership in Demonstration of Carbon Capture Technologies

  • Green Building and Sustainable Operations Certification

  • Conclusion & Outlook

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