TSMC Unleash Innovation: From AI to Edge: Advanced Packaging Innovation and Challenges
Original Article by SemiVision Research (TSMC)
TSMC presented a highly impressive agenda at this closed-door meeting. Earlier, we mentioned the Silicon Photonics Session, delivered by Dr. C.S. Yoo, Vice President of Research and Development / More-than-Moore Technologies at TSMC.
In addition, the Advanced Packaging Innovations session featured Dr. Kathy Yan, Director of New Technology & System Integration, Advanced Packaging and Test at TSMC.
For the Advanced Testing Session Keynote, Kam Lee, Senior Director and Deputy Head of TSMC Advanced Packaging Technology and Service, delivered a presentation on: Wafer Test Challenges in the HPC AI Era
We will engage in in-depth discussions around these topics.
Beyond AI/HPC in the Cloud: The Rise of Edge Computing
The Key Role of 3DFabric™ in the New AI Era
Customer Innovations Push the Trend of AI Chips
Edge Computing Booming in the Next Decade
Future Trends in Edge Computing Applications
From Cloud to Edge Computing
CoWoS-R’s Design Flexibility with High Routability
TSMC’s Strategic View on the Future of HBM Technology
Accelerating Mass Production: The Advantage of TSMC’s Platform Maturity
Integrated Thermal Solution for High Power Evolution
