2025 TSMC North America Technology Symposium_Topics Discussion_Part3
Original Articles by SemiVision Research
At the 2025 North America Technology Symposium, we explored TSMC’s technology roadmap in depth during Part 1, and in Part 2, we further analyzed topics such as advanced packaging technologies and green manufacturing initiatives. Moving into Part 3, we will focus on TSMC’s observations and outlook on the global semiconductor market for 2025.
In Part 3, SemiVision will conduct an in-depth analysis of TSMC’s perspectives on semiconductor market trends in 2025, extending the discussion to several core themes:
RF Component Demands from 5G to 6G Evolution: Analyzing TSMC’s process technology solutions for next-generation wireless communication (RF) applications.
Wi-Fi Technology Evolution: Exploring TSMC’s corresponding process platforms in the context of Wi-Fi 7 and Wi-Fi 8 development.
Automotive Market Solutions: Examining TSMC’s manufacturing and packaging strategies for the automotive sector, covering MCU, SoC, and PMIC applications in electric vehicles and advanced driver-assistance systems (ADAS).
Silicon Photonics Solutions: Introducing TSMC’s latest advancements in silicon photonics integration and co-packaged optics (CPO) technologies.
Advanced Packaging Technologies: Updating how TSMC is evolving its CoWoS platform by incorporating 3D IC concepts into advanced packaging applications.
In addition, TSMC highlighted the importance of Specialty Technologies in this year’s symposium, echoing the industry’s “More-than-Moore” development trend. Specific areas include:
High Voltage (HV) Applications: Covering automotive power management, industrial control, and smart energy systems.
CMOS Image Sensor (CIS) Technologies: Presenting innovative solutions for high-resolution, low-power, and high-dynamic-range (HDR) imaging applications.
These discussions not only resonate with the themes presented at the 2024 North America Technology Symposium but also delve deeper into technical details and application scenarios this year, further demonstrating TSMC’s comprehensive strategy and continued leadership across various domains within the semiconductor industry.
