EMC: From Copper to Light - Advanced CCL Solutions for Photonic Packaging
Original Article by SemiVision Research (TPCA Taiwan, JPCA, IMPACT, EMC, NVIDIA, TSMC)
Hosted by TPCA and TPCA Japan, today’s Kumamoto Taiwan High‑Tech Forum on June 10, 2025 brought together industry leaders including TSMC , SPIL, Unimicron, Elite Material Co., Ltd. , Nanya, Eternal and CSUN. Through a series of in‑depth keynote presentations, panel discussions, and technical exchanges, the forum spotlighted Kumamoto’s strategic rise as a vital hub in the Taiwan‑Japan semiconductor value chain—setting the stage for new partnerships in high‑tech manufacturing and material innovation.
The TPCA Taiwan-Japan Tech Forum has provided updated insights into the latest industry developments.
IMPACT Introduction: Since its inception in 2006, the IMPACT Conference has been at the forefront of technological evolution, fostering innovation in the packaging, PCB, and semiconductor industries. Over the past two decades, IMPACT has not only witnessed but actively contributed to rapid advancements in 5G, AI, high-performance computing (HPC), edge computing, and sustainability. Each year, the conference has adapted to the latest trends, driving forward the conversation on emerging technologies and their industrial applications.
Now in its 20th year, IMPACT 2025 embraces the theme “Energy-Efficient AI: From Cloud to the Edge,” reflecting the industry’s growing emphasis on high-performance, low-power solutions. As AI applications continue to expand—from data centers to edge devices—the need for advanced PCB, IC substrates, heterogeneous integration, and packaging technologies has become increasingly critical.
This milestone year marks not just a celebration of the past 20 years, but a bold step into the future, where IMPACT continues to lead, inspire, and drive innovation. Join us at IMPACT 2025 as we shape the next era of AI, semiconductor packaging, and PCB technology—powering a smarter, more sustainable world.
【Date】Oct. 21st (Tue.)-24th (Fri), 2025
【Venue】Taipei Nangang Exhibition Center
【Theme】Energy efficient AI: From Cloud to the Edge
【Organizer】IEEE-EPS, iMAPS Taiwan, ITRI, TPCA
【Feature】Plenary speech, Industrial session, Special session, Invited talks, PDC
【Exhibition】TPCA Show, TAITRONICS, AIoT Taiwan
【On-line Submission】www.impact.org.tw
Global Demand for High-End CCL Surges Rapidly
With the rise of high-speed computing and communication applications, the global copper-clad laminate (CCL) market is undergoing a structural shift. While growth in the traditional mid-to-low-end FR-4 segment is slowing, demand for high-frequency, high-speed advanced CCLs is increasing significantly.
In particular, the advent of AI servers in cloud data centers and the transition to 800G network switches has driven many manufacturers to adopt ultra-low-loss materials like M8-grade CCLs (e.g., Panasonic Megtron 8). Launched in 2022, Panasonic’s Megtron 8 supports 800GbE high-speed networks and features a dielectric loss factor (Df) of approximately 0.0015—about 25% lower transmission loss compared to the previous-generation Megtron 7 (Df ≈ 0.002).
These M8+ high-performance materials, known for their low dielectric constant and minimal signal loss, are becoming essential for next-generation high-speed PCB designs. According to a CCL industry report released by Goldman Sachs on November 20, 2024, the global high-end CCL market is projected to achieve a compound annual growth rate (CAGR) of 26% from 2024 to 2026—significantly outpacing the overall CCL market’s growth rate of around 9%.
Regional Market Development:
The supply of high-end CCLs is primarily concentrated in Asia, particularly in Taiwan, South Korea, and Japan. While Chinese manufacturers hold a strong position in the mid-to-low-end CCL market, they still lag behind in both technology and certification when it comes to ultra-high-frequency M8-grade materials. As a result, this segment is currently dominated by suppliers from Taiwan, Korea, and Japan.
Due to ongoing U.S.-China tech tensions, American tech giants increasingly rely on supply chains based in Taiwan, Korea, and Japan for their AI servers and high-speed network switches. This shift has driven up shipments of high-end CCLs from Taiwanese manufacturers. Key players in the M8-generation supply chain include Taiwan's EMC, TUC and Iteq, South Korea’s Doosan, and Japan’s Panasonic, forming the core competitive group in the current high-end CCL market.
For Paid Members ,SemiVision will discuss topics on
What is CCL?
EMC Group Sales Growth – From Foundation to Acceleration
EMC Global Ranking in 2023 – Market Leadership in HDI and Halogen-Free Laminates
EMC – Global No.1 in High-Speed Laminate (2023)
EMC Product Roadmap for FCBGA/SiP
What is AiP?
Key Industry Trends Reflected in the Image in AiP
Key Advantages of EMC’s HDI-Based Solutions
Chart Analysis: Insertion Loss vs. Frequency
Five Generations of Optical Module Evolution (2022–beyond)
Silicon Photonics (SiPh): The Key Enabler
Mega Trend in Optical Module material viewpoints from EMC
