OFC : Nvidia Copper Interconnection
If you would like to explore the silicon photonics roadmaps of TSMC and NVIDIA in greater depth, please refer to our previously published articles for more detailed analysis and insights.
How TSMC’s Silicon Photonics Could Impact NVIDIA’s Future
2025 GTC Review: The Silicon Photonics Era Has Arrived – Get Ready!
NVIDIA x TSMC: A Milestone in Silicon Photonics and Optical Integration
Nvidia GTC AI Conference Preview: GB300, CPO switches, and NVL288
TSMC and NVIDIA Pioneering the Future of AI with Silicon Photonics Technology
CPO Switch Technology Analysis
How to Distinguish Between CPO and OIO? What Is Their Fundamental Difference?
High-Frequency Copper Cabling in the Nvidia Blackwell Architecture: The Invisible Backbone of AI Performance
Introduction
Driven by the explosive growth of generative AI and large language models (LLMs), the demands on compute performance and interconnect bandwidth in data centers are reaching unprecedented levels. Nvidia’s Blackwell architecture, unveiled at GTC 2025, is designed to meet this challenge head-on—featuring ultra-large GPU clusters paired with state-of-the-art interconnect systems. This article focuses on one of the least visible yet most critical components behind this architecture: the high-frequency copper cabling system that enables efficient, low-latency GPU-to-GPU communication at scale.