15-Minute Deep Dive into the Data Center Cooling Revolution: From Chillers to Liquid Cooling

Original Article bBy SemiVision Research (NVIDIA, TSMC, AVC, Foxconn)

Feb 10, 2026

∙ Paid

Industry Background and Trends: Cooling Innovation Driven by the High-Power AI Era

The rapid rise of AI servers and high-performance computing (HPC) has pushed data center cooling requirements to an unprecedented level. The latest generation of AI chips—such as NVIDIA’s H100 and Grace Hopper—now carry thermal design power (TDP) ratings that often reach s…

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