Miss It and Fall Behind: The Ultimate Technology Pilgrimage Every Semiconductor Professional Must Make
Original Article by SemiVision Research (ISSCC,OFC,ECOC,OIP,ECTC,VLSI,IEDM,IITC,DRC,DAC,HotChip,TSMC OIP , TSMC Tech, Laser World, ITF, OCP, Semicon Taiwan ,TPCA ,TPCA IMPACT)
The semiconductor industry today stands at the brink of a technological explosion — from AI chips and photonic integration to advanced packaging and atomic-level processes, every innovation is reshaping the competitive landscape of the global supply chain. This is an extremely highly integrated industry, where no single company can independently cover the entire spectrum from materials, design, manufacturing, and packaging to testing.
Only through continuous learning and active participation in global technical dialogues can we find our place in an increasingly turbulent future.
This is precisely why participating in the world’s most influential semiconductor and photonics technology forums is not just a path to knowledge advancement—it is a critical platform for strategic collaboration, trend forecasting, and network building.
Below is our curated list of key annual conferences, categorized by technical domain. Together, they span the full spectrum from materials physics and chip architecture to systems and ecosystem integration:
ISSCC (International Solid-State Circuits Conference)
The world’s most prestigious forum for solid-state circuit design, where leading-edge SoC and high-performance IC design breakthroughs are first unveiled.OFC / ECOC
The two flagship conferences in optical communications and photonic integration—showcasing advances in transmission, modules, network architecture, and quantum communication.Optical Interconnection and Packaging Conference (OIP)
An international platform dedicated to high-bandwidth optical interconnects and packaging integration. It focuses on Co-Packaged Optics, WDM, integrated light sources, SerDes, yield, and system power—providing strategic direction and standards momentum for photonics in the AI/HPC era.IEEE ECTC (Electronic Components and Technology Conference)
A global stage for packaging technologies, reliability engineering, 3D integration, and advanced optoelectronic packaging innovations.VLSI Symposium
The gold-standard forum for device and circuit innovation, showcasing leading-edge research from transistors to system-level integration.IEDM (International Electron Devices Meeting)
The most authoritative conference for breakthroughs in nanoscale devices and advanced semiconductor processes, where equipment and materials converge.IITC (International Interconnect Technology Conference)
A specialized venue for interconnect and metallization technologies, covering key milestones from BEOL processing to 3D interconnects.DRC (Device Research Conference)
A cradle for deep explorations into device physics and novel material electronics, bridging academia and real-world implementation.DAC (Design Automation Conference)
A premier platform for innovations in EDA, system-level design, and AI-driven automation flows.Hot Chips
The temple of high-performance computing architecture announcements—where chip designers dissect their latest innovations firsthand.TSMC OIP Forum (Open Innovation Platform)
A high-level summit led by TSMC, focusing on cross-domain integration strategies across 3DIC, silicon photonics, and wafer platform ecosystems.Optica Advanced Photonics Congress
A multidisciplinary symposium exploring the intersection of optical materials, integrated photonics, and AI applications.Laser World of Photonics
The world’s largest exhibition for optoelectronic components, systems, and applied photonics technologies.ITF World (Imec Technology Forum)
A system-level view on digital transformation and AI strategy—spanning devices, platforms, and application ecosystems.OCP Global Summit (Open Compute Project)
The global gathering for leaders in data center and open hardware ecosystems—covering servers, storage, liquid cooling, and AI infrastructure.SEMICON Taiwan / TPCA / IMPACT
An integrated supply chain summit spanning manufacturing, packaging, materials, and smart factories, blending global perspectives with local innovation to drive technological and market insight into the industry.Computex Taipei
COMPUTEX TAIPEI is one of the world’s leading technology trade shows, showcasing innovations in AI, computing, and global hardware ecosystems.
These forums are not merely stages for technical demonstration—they are critical junctions for syncing with global innovation rhythms and decoding the logic of industry decision-making.
From the physical limits of devices, to chip design, packaging integration, system realization, and ecosystem collaboration, every event represents a force pushing the industry forward.
If you aspire to be a participant and contributor in the next wave of technological inflection, these international conferences are your starting point.
Choose to engage in global dialogue—choose to stand at the frontier of the future.
Following the recently concluded IEEE ECTC and VLSI Symposium, the next must-attend international conference is the upcoming Device Research Conference (DRC).
As one of the most historic and influential events in the field, DRC is dedicated to cutting-edge research in electronic device physics, design, and fabrication, covering key topics such as advanced CMOS, nanowire transistors, 2D material devices, emerging memory, sensors, and heterogeneous integration platforms.
If you’re deeply interested in transistor architecture evolution, innovative device materials, electrical simulation, or experimental validation, DRC is without a doubt one of the most essential academic and technical venues to attend this year. It’s where you’ll find original work presented by top researchers from leading universities and R&D institutes worldwide, and where you can connect directly with those shaping the future of electronics.
The 2025 DRC will be held June 22–25 at Duke University, USA, and registration and agenda details are now available.
For engineers and researchers focused on fundamental device innovation, this is not just a technical event—it’s an intellectual journey. Don’t miss it!
As the semiconductor and photonics industries enter an era of unprecedented innovation acceleration, top global conferences and technical forums have become essential platforms for technology exploration, industry dialogue, and trend forecasting.
Here is a timeline of the most important conferences of 2025, organized chronologically to help you plan your participation effectively:
(Timeline to be provided in the next section if needed)
ISSCC – International Solid-State Circuits Conference 2025
Organizer: IEEE Solid-State Circuits Society (SSCS), sponsored by IEEE
Focus: The world’s premier forum for solid-state circuits and SoC design, covering advanced IC circuits, mixed-signal, energy-efficient design, imaging, memory, RF systems, and emerging architectures.
Date: February 16–20, 2025
Location: Marriott Marquis, San Francisco, California, USA
Website: https://www.isscc.org/
OFC – Optical Fiber Communications Conference & Exhibition
Organizer: Jointly organized by Optica and IEEE Photonics Society
Focus: The world’s leading event for optical communications and networking technologies. Topics include photonic devices, system architectures, quantum networking, AI-driven communications, co-packaged optics, exhibitions, and forums.
Date: March 30 – April 3, 2025 (Exhibition: April 1–3)
Location: Moscone Convention Center, San Francisco, California, USA
Website: ofcconference.org
ITF World 2025 (Imec Technology Forum World)
Organizer: imec
Focus: Semiconductor and AI-driven digital transformation, process innovation, heterogeneous integration, and future platform technologies.
Date: May 20–21, 2025
Location: Antwerp, Belgium Website: https://www.imecitf.com/world
IEEE ECTC – Electronic Components and Technology Conference
Organizer: IEEE
Focus: Packaging, components, microsystems, 3D packaging, photonic integration, modeling, and reliability. Includes short courses and paper presentations.
Date: May 27–30, 2025
Location: Gaylord Texan Resort & Convention Center, Dallas, Texas, USA
Website: ectc.net
IEEE IITC – International Interconnect Technology Conference
Organizer: IEEE
Focus: Innovations in metallization, advanced interconnects, 3D IC integration, and backend-of-line (BEOL) process technologies.
Date: June 2–5, 2025
Location: The Westin Josun, Busan, South Korea
Website: iitc2025.org
Symposium on VLSI Technology and Circuits
Organizer: IEEE / JSAP (Japan Society of Applied Physics)
Focus: Advanced semiconductor processes, device design, circuit-system integration. Includes short courses, invited talks, demos, and awards.
Date: June 8–12, 2025
Location: RIHGA Royal Hotel, Kyoto, Japan
Website: vlsisymposium.org
OIP 2025 – Optical Interconnects and Packaging Conference
Organizer: IEEE
Focus: High-density optical interconnects and packaging technologies, including co-packaging, SerDes, light source integration, WDM, 3D/2.5D packaging, process yield, and AI-driven system architectures.
Date: June 16–18, 2025 (Starts 8:00 AM June 16, ends 4:00 PM June 18)
Location: Elizabeth Hotel, 111 Chestnut Street, Fort Collins, Colorado, USA
Website: oip-conference.org
DAC – Design Automation Conference
Organizer: ACM / IEEE
Focus: Electronic Design Automation (EDA), system design, automation workflows, AI-driven design, and heterogeneous systems.
Date: June 22–25, 2025
Location: Moscone Center West, San Francisco, California, USA
Website: dac.com
DRC – Device Research Conference
Organizer: IEEE
Focus: Fundamental research in electronic and optoelectronic devices, simulation, and emerging device development, with an emphasis on academic and applied innovation.
Date: June 22–25, 2025
Location: Duke University, Durham, North Carolina, USA
Website: deviceresearchconference.org
Laser World of Photonics 2025
Organizer: Messe München
Focus: The largest global event for laser and photonics technologies, covering components, systems, applications, quantum and manufacturing innovations.
Date: June 24–27, 2025 (Photonics Congress: June 22–27)
Location: Messe München, Munich, Germany
Website: world-of-photonics.com
Hot Chips 2025
Organizer: IEEE
Focus: High-performance chip architecture, system design, and implementation insights, directly presented by the chip designers.
Date: August 24–26, 2025
Location: Stanford Memorial Auditorium, Palo Alto, California, USA
Website: hotchips.org
SEMICON Taiwan 2025
Organizer: SEMI (Semiconductor Equipment and Materials International)
Focus: The largest semiconductor trade show and forum in Asia, covering wafer fab, materials, advanced packaging, testing, automation, silicon photonics, heterogeneous integration, AI chips, talent development, and supply chain security across 13 core topics.
Date: September 10–12, 2025
Location: TaiNEX 1 & 2, Taipei, Taiwan
Website: semicontaiwan.org
Note: As the most critical annual semiconductor supply chain event in Asia-Pacific, SEMICON Taiwan connects academia, industry, and government. It drives innovation in manufacturing, packaging, sustainability, and academia-industry collaboration. It’s a must-attend event for equipment suppliers, material partners, IC designers, and tech startups.
ECOC – European Conference on Optical Communication 2025
Organizer: European Conference on Optical Communication
Focus: Optical communication components, modules, systems, and network applications. A flagship event in the European photonics sector.
Date: September 28 – October 2, 2025 (Exhibition: September 29 – October 1)
Location: Bella Center, Copenhagen, Denmark
Website: ecoc2025.org
OCP Global Summit 2025
Organizer: Open Compute Project Foundation
Focus: Open hardware architecture and data center innovations, including servers, storage, networking, power, and cooling solutions.
Date: October 13–16, 2025
Location: San Jose McEnery Convention Center, San Jose, California, USA
Website: opencompute.org/summit/global-summit
TPCA IMPACT 2025 – International Microsystems, Packaging, Assembly and Circuits Technology Conference
Organizer: TPCA (Taiwan Printed Circuit Association)
Focus: Under the theme “Energy-Efficient AI: From Cloud to the Edge,” the conference emphasizes heterogeneous integration, high-speed packaging, AI system design, and PCB process innovations.
Date: October 21–24, 2025
Location: Nangang Exhibition Center, Taipei, Taiwan
Website: impact.org.tw , https://tw.tpcashow.com/en/
IEEE IEDM – International Electron Devices Meeting 2025
Organizer: IEEE
Focus: Leading conference on process technology innovation, advanced CMOS, sensors, memory, quantum, and emerging device architectures.
Date: December 6–10, 2025
Location: Hilton Union Square, San Francisco, California, USA
Website: ieee-iedm.org
These conferences span across process technology, circuits, packaging, EDA, photonics, systems, and data centers. They serve as the most valuable sources of knowledge and collaboration platforms for professionals in semiconductor and optoelectronic R&D, manufacturing, and design.
If you would like assistance with registration information, agenda highlights, or submission advice, feel free to reach out.
In addition, the TSMC Technology Symposium is another must-attend industry event. Hosted directly by the world’s leading foundry, this symposium offers an in-depth view of process evolution, advanced packaging, ecosystem collaboration, and system integration. Attending this forum gives you early access to key updates on 2nm, A16, SoIC, CoWoS, InFO, and more, while also offering insights into the future cadence and platform strategies of global semiconductor manufacturing.
The semiconductor industry is now at a critical tipping point of technological explosion—from AI chips and photonic integration to advanced packaging and atomic-scale processes, every innovation is reshaping the competitive dynamics of the global supply chain. This is a highly integrated industry, where no single company can independently execute the full pipeline from materials and design to fabrication, packaging, and testing.
Continuous learning and deep engagement are the only ways to build resilience and stay competitive in the future.
That’s why participating in the world’s most prominent conferences and forums is not optional—it is a vital responsibility for every industry professional, researcher, and decision-maker.
Following IEEE ECTC and the VLSI Symposium, the next major stop is the Device Research Conference (DRC), held on June 22–25, 2025, at Duke University, USA.
This conference is a sanctuary for cutting-edge research in device physics, design, and fabrication—from advanced CMOS, nanowires, and 2D material devices to emerging memories and sensors, all the frontiers are here.
Next comes one of the most anticipated events of the year—the TSMC Technology Symposium, with the 2025 sessions as follows:
April 23 – North America (Santa Clara)
April 29 – Austin Workshop
May 6 – Boston Workshop
May 15 – Taiwan (Hsinchu)
May 27 – Europe
June 11 – Japan (Yokohama)
June 25 – China (Shanghai)
These sessions cover key global markets and showcase how TSMC is pushing chip design forward through wafer processing, 3D Fabric, silicon photonics, and system integration, enabling higher-density, higher-performance architectures.
Another key annual event is the TSMC OIP Ecosystem Forum.
The Open Innovation Platform (OIP) Forum focuses on EDA tools, IP, ecosystem collaboration, and heterogeneous integration platforms. It covers practical design cases for CoWoS, SoIC, N3/N2 nodes, and photonic platforms.
Every year, it attracts thousands of professionals from EDA, IC design, packaging, and IP companies to discuss how to accelerate time-to-market, simplify design, and advance AI, HPC, and low-power computing.
It is one of the few forums that truly bridges EDA × process × packaging × systems, and serves as a hands-on arena for realizing the full value chain of foundry platform collaboration.
Other must-attend conferences include:
IEDM – For innovation in device and process technologies
IITC – Interconnect and metallization
DAC – EDA and system-level design
Hot Chips – High-performance chip architecture
OFC / ECOC – Optical communications
OIP (Optical Interconnection & Packaging) – Optical packaging and interconnect
Optica Congress – Multidisciplinary exchange on optics and AI
Laser World of Photonics – Photonic components and systems
SEMICON Taiwan / TPCA IMPACT – Supply chain and packaging/materials innovation
Each of these forums is where cutting-edge research meets real-world applications, forming a crucial link between academia, industry, and product innovation.
This is more than attending an event—it’s a commitment to industry evolution.
From process leadership to system architecture, from device innovation to ecosystem collaboration, these forums provide the technical vision, industry influence, and professional network you need.
Start planning your participation now, and stay in step with the world’s most important semiconductor thinking and momentum.
This is the opportunity for forward-thinkers—you need to be there.
If you’re familiar with or organizing other international semiconductor or photonics forums not listed above, we welcome your input.
SemiVision is committed to providing the industry community with the most complete and up-to-date global event map—so that every reader can stay informed and engaged with the world’s most impactful technology exchange platforms.
Please contact us at:
📩 jett@semivisiontw.com
📩 eddyt@semivisiontw.com
Let’s expand this professional list together and drive the global conversation around technology and innovation.